LED Display Solution
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LED Display Solution
In the rapidly evolving field of LED display technology, packaging methods play a crucial role in determining image quality, durability, and cost-efficiency. Each packaging type directly influences display brightness, contrast, thermal performance, and is tailored to specific application needs—from outdoor billboards to automotive and virtual production displays. Our company offers a comprehensive range of LED packaging solutions including DIP, SMD, COB, GOB, MIP, and IMD technologies. Whether you're seeking high-performance or cost-effective solutions, our advanced manufacturing processes help you deliver displays with superior visual impact and long-term reliability.
LED Packaging Technology Comparison
Dual In-Line Package (DIP)
DIP packaging was one of the earliest mainstream LED display technologies, involving direct insertion of LED beads into the PCB. While considered mature and cost-effective, it is now mainly used in large-pitch and budget-conscious applications such as outdoor advertising.
➤Low cost, ideal for large-scale installations
Surface Mounted Devices (SMD)
SMD is the most commonly used packaging method today, with LED beads surface-mounted onto the PCB. Suitable for pitch ranges like P2–P10, SMD offers good heat dissipation, display consistency, and is widely adopted in both indoor and mid-sized outdoor displays.
➤Mature technology with great cost-performance
Chip on Board (COB)
COB packages LED bare dies directly onto the PCB, followed by full encapsulation. This enables ultra-fine pixel pitch and a softer, high-quality image. The simplified structure improves reliability and is ideal for displays below P1.25 pitch.
➤Softer, eye-friendly visuals
Glue on Board (GOB)
GOB uses a high-transparency optical glue to encapsulate the
LED surface, significantly enhancing protection against dust, moisture, and
impact. It's ideal for rugged environments like rental displays and
high-traffic outdoor applications.
➤Ideal for demanding environments
Micro LED in Package (MIP)
MIP involves packaging Mini/Micro LEDs through chip
splitting, mass transfer, and optical processing. It supports ultra-fine pitch
and high brightness, ideal for automotive, virtual production, and premium
consumer displays.
➤Suited for HDR and dynamic visuals
Integrated Matrix Device (IMD)
IMD, also known as "n-in-1" packaging, merges
benefits of SMD and COB. A common example is 4-in-1 packaging, integrating
multiple RGB chips in a single unit for better image quality, simplified
maintenance, and tighter integration.
➤Compact design supports high resolution
